Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Roger Stout. To view the webinar, click here. Question: I thought power density (W/sq.mm) went up at the rate of Moore's Law? Are you saying it doesn't? Answer: Yes and no. The problem is, feature size on silicon chips keeps decreasing – that's what Moore's Law is all about. As … [Read more...]
Data Center Liquid Cooling Process Wins Energy Efficiency Award
The Uptime Institute has recognized 3M Company, Iceotope Research and Development Ltd. and the University of Leeds in the UK as joint-Green Enterprise IT (GEIT) award winners for their development of new data center liquid cooling methodologies designed to improve energy efficiency in data servers. Based in New Mexico, the Uptime Institute offers education, consulting, … [Read more...]
PMIC Helps Reduce Thermal Stress of Smartphone and Tablet Processors
Patented design enables board designers to place the new AS3721 PMIC and applications processor further apart to reduce hotspot intensity. Ams AG, a provider of high performance analog ICs and sensors, has introduced the AS3721, a power management IC with a remote-feedback circuit that helps manage the thermal stress of applications processors in space-constrained … [Read more...]
Micro-Vacuum Technology May Cool Future Smartphone Processors
Researchers from the University of Michigan, Massachusetts Institute of Technology (MIT) and Honeywell International, Inc. have developed microscale vacuum pumps that could lead to tiny, more efficient cooling systems for faster processors in smartphones. Developed as part of DARPA’s Chip-Scale Vacuum Micro Pumps (CSVMP) program, the new microscale vacuum pumps are intended … [Read more...]
Electronics Cooling Announces New Editor
Electronics Cooling is proud to announce the addition of Peter Rodgers to the technical board. Rodgers is currently an associate professor of mechanical engineering at The Petroleum Institute, Abu Dhabi, UAE. He previously worked at the University of Maryland; Nokia (Finland); Electronics Thermal Management, Ltd. (Ireland), and the University of Limerick (Ireland). He is a … [Read more...]
- « Previous Page
- 1
- …
- 153
- 154
- 155
- 156
- 157
- …
- 341
- Next Page »
