Electronics Cooling is proud to announce the addition of Peter Rodgers to the technical board. Rodgers is currently an associate professor of mechanical engineering at The Petroleum Institute, Abu Dhabi, UAE. He previously worked at the University of Maryland; Nokia (Finland); Electronics Thermal Management, Ltd. (Ireland), and the University of Limerick (Ireland). He is a … [Read more...]
Editorial: Thermal Engineering and the Search for the Higgs Boson
In science, it’s rare that a revolutionary new theory is not preceded by groundbreaking experiments. More often than not, the timing of such experiments has depended on prior advancements in technology and engineering. The Large Hadron Collider (LHC) at CERN near Geneva, Switzerland, where the critical experiments to find the Higgs boson were conducted, depended for its … [Read more...]
Manufacturing Plant for Nanoceramic-Aluminum Substrate Technology to Be Built in Haverhill
Electronics thermal management provider Cambridge Nanotherm has announced plans to build its first prototype manufacturing plant in Haverhill, UK following the award of £250,000 in matched funding from the UK Innovation Agency - Technology Strategy Board (TSB). The company plans to use the new facility to further develop its new nanoceramic-aluminum substrate technology, and to … [Read more...]
DuPont Increases Thermal Substrate Production to Accommodate Demand
DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced earlier this week that it has increased production at its Hsinchu, Taiwan facility by more than seven times the previous amount to better accommodate demand for its CooLam thermal substrate products. DuPont CooLam thermal substrates are designed to help dissipate heat in LED … [Read more...]
Two Thermally Conductive Compounds Added to TIM Product Line
Silicones supplier Dow Corning has added two new products—Dow Corning TC-5622 and TC-5351 Thermally Conductive Compounds—to its line of thermal interface materials. Offering good thermal performance and improved resistance to hardening or dry-out in end-use applications, Dow Corning’s TC-5622 thermally conductive compound is ideal for applications where heat must be dissipated … [Read more...]
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