An Arizona State University engineer has been awarded a grant from the U.S. Air Force Office of Scientific Research for nanoscale heat transfer research that could help improve thermoelectric devices and thermal barrier coatings. An assistant professor of aerospace and mechanical engineering at ASU’s School for Engineering of Matter, Transport and Energy, Robert Wang was … [Read more...]
Thermal Characterization Tools for Testing and Evaluation of TIM Materials
Thermal Engineering Associates, Inc. (TEA) has announced the availability of a new family of thermal interface material characterization tools. According to TEA, the new tools are designed to make the testing and evaluation of TIM materials simpler and more cost-efficient, and are comprised of the company’s thermal test chip—available in sizes ranging from 2.5mm square to … [Read more...]
Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems Announced
Graphite mining and exploration company Focus Graphite Inc. has announced a joint venture development agreement on behalf of Grafoid Inc. with CapTherm Systems Inc., a developer of cooling technologies for high-power electronics, to develop and commercialize next-generation, multiphase thermal management systems for electric vehicle (EV) battery and light emitting diode (LED) … [Read more...]
Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology
In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is modelled explicitly, no abstraction into a thermal resistor equivalent model, no hiding all the proprietary design information inside either. Pros and cons of detailed models I covered a few years ago in this blog. Packaged ICs are complex, constructed of many parts, … [Read more...]
IBM Awarded Contract in First Phase of DARPA ICECool Program
Researchers at IBM Corp. in New York are reportedly examining potential ways to directly integrate liquid cooling into microchip designs and packaging to help “close the gap” between the chip and chip-cooling technologies in high performance military electronic systems. The IBM project is part of DARPA’s Intrachip/Interchip Enhanced Cooling (ICECool) program, which seeks to … [Read more...]
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