Cooling solutions provider Noctua has released two new models from the NH-U series of quiet, single tower CPU coolers. Both models reportedly feature a “new, slim design that ensures easy RAM access and maximum compatibility with tall memory modules.” "Representing the next generation of this venerable legacy, the new NH-U12S and NH-U14S are the result of almost 10 years of … [Read more...]
Ball Bearing for Cooling Fan Motors Handles High-Speed Motor Operation
NSK Ltd., a developer of industrial bearings, automotive bearings and modules and linear motion products, has released a high-performance ball bearing for cooling fan motors used in personal computers, data servers and communication base stations. According to the company, the new bearing features “an optimized grease that does not easily break down . . . thus preventing … [Read more...]
Thermoelectric Air Conditioner for Use in Mobile Military and Defense Applications
Thermoelectric air conditioner manufacturer EIC Solutions, Inc. has released the ThermoTEC 145 series 1500 BTU military-grade air conditioner for use in transit cases for mobile military and defense applications. According to Jamie Alletag, EIC Solutions sales engineer, the rugged 145 series military-grade cooler’s auto ranging feature makes the units completely functional in … [Read more...]
Vibration-Free Cooling Technology to Replace Mechanical Compressors in Sensitive Space Applications
Researchers at the University of Twente in the Netherlands have developed a new technology for cooling optical detectors on spacecraft that could help the sensors better detect weak “space signals” that originate from far-away, extremely cold sources. The new development is part of a project commissioned by the European Space Agency. Current cooling systems use mechanical … [Read more...]
Three-Dimensional Chip-Cooling Technology Could Multiply Heat Removal Tenfold
Researchers from the Georgia Institute of Technology in Atlanta, Ga. have been awarded a $2.9 million Defense Advanced Research Projects Agency (DARPA) contract to develop three-dimensional chip-cooling technology capable of dissipating up to 10 times the amount of heat currently removed by cooling systems used today. The new technology will also need to successfully manage … [Read more...]
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