Accelerated Market Adoption of Direct Liquid Cooling and Key Partnerships Lead to Another Bright Year Ahead. CALGARY, Alberta, April 6, 2021 /PRNewswire-PRWeb/ -- CoolIT Systems, the global leader in scalable direct liquid cooling technology (DLC) for desktop and data centers systems with over 4 million coldplate solutions shipped to date, has reached a significant business … [Read more...]
New High-Temperature Thermoelectric Coolers from Laird Thermal Systems Cool Optical Sensors in Advanced Driver-Assistance Systems (ADAS)
High-temperature autonomous systems require active cooling to ensure proper, long life performance… March 11, 2021 – Advanced driver-assistance systems (ADAS) use a variety of imaging sensors, cameras and lasers to enhance vehicle safety and create better driving conditions. Most of these optical devices, including CMOS sensors and laser diodes, are heat sensitive and rely on … [Read more...]
One Part Fast Curing Epoxy for Bonding and Small Encapsulation Applications
Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing … [Read more...]
Teledyne to Acquire FLIR Systems
THOUSAND OAKS, Calif. and ARLINGTON, Va. – January 4, 2021 – Teledyne Technologies Incorporated (NYSE:TDY) (“Teledyne”) and FLIR Systems, Inc. (NASDAQ:FLIR) (“FLIR”) jointly announced today that they have entered into a definitive agreement under which Teledyne will acquire FLIR in a cash and stock transaction valued at approximately $8.0 billion. Under the terms of … [Read more...]
New Tflex SF10 Silicone-free Gap Filler Delivers 10 W/mk Thermal Conductivity, Excellent Deflection Properties
CLEVELAND, Ohio – February 26, 2021 – Laird Performance Materials continues to focus on innovation with its release of its Tflex™ SF10 Series, a silicone-free gap filler delivering 10 W/mk thermal conductivity along with low deflection properties enabling it to exert minimal pressure on delicate components. Along with no silicone and its high thermal conductivity, a key … [Read more...]
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