A lawsuit filed earlier this month by liquid cooling solutions developer Asetek alleges that Cooler Master’s Seidon family of sealed-loop coolers introduced recently infringe upon patent No. 8,240,362 and patent No. 8,245,764 held by Asetek. Both patents reference a liquid-cooling system connected to a pump and radiator that is designed to be fully integrated into a single, … [Read more...]
Thermally Conductive Acrylic Interface Pads Provide ‘Excellent Conformability’ and ‘Compressive Stress Relaxation’
Rathbun Associates, a provider of 3M thermal, VHB and EMI solutions, has released 3M thermally conductive acrylic interface pads, high-performance non-silicone-based thermal pads for use in non-silicone applications. According to the company, the new acrylic thermal interface pads provide “good softness and conformability to non-flat surfaces [and] excellent compressive stress … [Read more...]
Electronics Cooling Simulation Software Enables ‘Earlier Virtual Prototyping’, ‘Fewer Design Iterations’ in MDA and EDA Domains
Mentor Graphics, a developer of electronic hardware and software design solutions, has announced FloTHERM XT, an electronics cooling simulation software package that enables “earlier virtual prototyping, fewer design iterations and advanced ‘what if’ analysis for improved product quality and faster time-to-market benefits.” According to Mentor Graphics, the new software is … [Read more...]
Special Evening Program at SEMI-THERM March 20
"Designing Energy Efficient Data Centers: The National Science Foundation Industry University Cooperative Research Center (IUCRC) on Energy Smart Electronic Systems (ES2)" will take place Wednesday, March 20. The presentation will be from 6:45 to 7:30 p.m. and a panel discussion will follow from 7:30 to 8:30 p.m. Alfonso Ortega from Villanova University will lead the … [Read more...]
Workshop on Composite Preforms at SEMI-THERM
Experts at Indium Corporation's will present a workshop on Composite Solder Preforms for High Temperature Pb-free Die Attach Wednesday, March 20, 2013 at SEMI-THERM. Jordan Ross, senior product manager of engineered solders and thermal materials, and Weiping Liu, research metallurgist, will discuss high temperature Pb-free solder materials needed in die-attach, flip-chip … [Read more...]
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