Metal-matrix composites developer CPS Technologies Corp. announced a conference call was held at 5 p.m. EDT to discuss the company’s financial results for the fourth quarter. Grant Bennet, president and chief executive officer, and Ralph Norwood, chief financial officer, presented the results. Additional information is not available at this time. For more information, visit … [Read more...]
Heat Transfer at 'Any Temperature' Makes Thermal Interface Film Suitable for Cold Plate Applications
Thermal interface material developer AOS Thermal Compounds recently released Micro-Faze, a thermal interface film formulated with non-silicon thermal grease. According to AOS Thermal Compounds, Micro-Faze “requires minimum force to achieve total interface contact” and “Retains all the performance advantages of thermal grease . . . in the form of a thermal pad.” Suited for cold … [Read more...]
SEMI-THERM Draws Thermal Engineers; View Our Photos
SEMI-THERM takes place this week in San Jose, Calif. Below are photos taken by Electronics Cooling staff. Photos, from top, include: Electronics Cooling editors Jim Wilson and Bruce Guenin pose with the latest issue of Electronics Cooling. Business Manager Casey Goodwin chats with a visitor at the Electronics Cooling booth. A view of the exhibit hall. The … [Read more...]
SEMI-THERM Presents Executive Briefing
This year, SEMI-THERM has introduced the Executive Briefing: Thermal Management Market Visions & Strategies conference in conjunction with the SEMI-THERM annual symposium. Aimed at bringing technology and technical leaders, C-Level executives and engineering, product development and business managers together, the executive briefing program will focus on current market … [Read more...]
Low-Viscosity Thermally Conductive Silicone Compound
Fujipoly introduces its SARCON SPG-20A, a low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material fills gaps up to .50 mm in height. According to the company, "The form stable thermal compound requires no heat curing, will not cause corrosion on … [Read more...]
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