STULZ Air Technology Systems, Inc., a provider of cooling solutions and services for mission critical applications, has released the STULZ CyberCon modular outdoor cooling system designed for fast deployment with containerized computer rooms (PODs). According to the company, the new cooling system’s modular design “reduces up-front capital costs and adapts to rapidly changing … [Read more...]
Modular Aisle Containment Solution Separates Hot and Cold Airflows in Energy-Efficient Manner
Data center developer Minkels has released its Next Generation Cold Corridor, “a modular and highly flexible aisle containment solution that separates hot and cold airflows in an energy-efficient manner.” The new data center cooling solution was presented London’s Data Centre World 2013 conference in late-February. According to Jeroen Hol, chief executive officer at Minkels, … [Read more...]
New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
German power supplies manufacturer Be Quiet! Has released DC1, a new high performance thermal compound for critical cooling applications. According to the company, the new electrically non-conductive, metal oxide-silicone thermal compound features a “very high thermal conductivity of 7.5w/mK [that] provides exceptional heat transfer between chip and cooler” and is capable of … [Read more...]
New Customizable Heat Sinks for Use in High Power Environments and Resistors
Ohmite Manufacturing, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has announced two new heat sinks: the C series modular heat sink for use in high power environments and the CP series of cold plate four-pass heat sinks for use with the company’s 1,000 and 2,000 watt TAP series of resistors. The new heat sinks will … [Read more...]
Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military Platforms
Authors Johannes van Es and Henk Jan van Gerner, National Aerospace Laboratory NLR, The Netherlands The next generation military platforms will be equipped with more and more powerful sensors and avionics. The increasing power densities in electronic subsystems demand more cooling power while survivability requirements limit the possibilities for extending or adding … [Read more...]
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