Don’t miss out on the March 2013 issue of Electronics Cooling, which includes the 2013 Buyers’ Guide, feature articles on Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, Measuring and Predicting Junction Temperature: Thermal Factors Influencing Reliability in GaN HEMTs, … [Read more...]
40x40x56mm Counter-Rotating Fan for High-Density 1U Servers, Power Supplies and High-Density Electronic Enclosures
Thermal solutions provider JMC Products has released a new 40x40x56mm counter-rotating fan ideal for high-density 1U servers, power supplies and high-density electronic enclosures. According to the company, “counter-rotating technology has allowed engineers at JMC to design [the fan] with extremely powerful airflow and speed, while maintaining high efficiency and an … [Read more...]
New Silicone-Based Material May Increase Computer Speeds without Increasing Energy Consumption, Heat
Scientists from Dow Corning Electronic and IBM have developed a new high-performance, silicone-based material that could replace copper in waveguides and enable supercomputers to use energy more efficiently while simultaneously allowing for an increase computing speeds. Developing a method for increasing computer speeds without increasing energy consumption, and therefore heat, … [Read more...]
Liquid Cooling Systems Developer Announces U.S., China Patents Covering Liquid Cooling Technology
Asetek, a developer of energy efficient liquid cooling systems for data centers, servers and high performance PCs, has announced the issuance of two new patents. Issued by the U.S. Patent Office, patent no. 8,358,505 covers technology used for liquid cooling of “small form factor computing devices,” including laptops and blade servers. Patent no. 2005800500092, issued by the … [Read more...]
New Type of Heat-Conducting Paste “Optimized” for Thermal Management of Power Semiconductors
Infineon Technologies AG and Henkel Electronic Materials have collaborated to release a new type of heat-conducting paste “optimized” for thermal management of power semiconductors. According to the two companies, the new compound allows a higher power density for the same ageing resistance. According to Dr. Martin Schulz of Infineon Technologies AG, “[LOCTITE TCP 7000] … [Read more...]
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