U.K. startup Versarien will provide a demonstration of porous metal technology and its potential uses in thermal management products during the Electronica exhibition in Munich, Germany this week. The startup was created after CEO Neil Ricketts began collaborating with researchers at the University of Liverpool to examine the use of porous metals for strength-to-weight ratio … [Read more...]
Research Suggests Ferroelectric Crystals May Assist with Computer Chip Heat Regulation
Researchers at the Carnegie Institution in Washington, D.C. have discovered a new, efficient way to extract heat using ferroelectric crystals. The crystal materials exhibit an electrical polarization in the absence of an electrical field that can be reversed by applying an external electrical field, resulting in a significant temperature change. Ronald Cohen, staff scientist … [Read more...]
CFD Software Seminar
December 3-4, 2012 in San Francisco, CA December 6-7, 2012 in Los Angeles, CA Cradle North America will be holding two training courses on scSTREAM in the San Francisco and Los Angeles area. According to the company, scSTREAM is one of the most popular Computational Fluid Dynamics software used in electronics industries in Japan. The main objective of the course is to enable … [Read more...]
Researchers Develop Possible New Heat Dissipation Method with Cold Plasma Treatment
Researchers from the College of Materials Science and Engineering at Beijing University of Chemical Technology in China have determined a new method for enhancing heat dissipation in microelectronics based on research on plasma-treated h-BN fillers. According to results published by Professor Yonglai Lu and Tui Ji, a master of engineering at the Center of Advanced Elastomer … [Read more...]
Heat-Transfer Material for Rapid Removal of Heat from LED Circuit Boards
The U.S. Department of Energy has awarded a small business innovation research (SBIR) grant to Applied Nanotech for $150,000. The grant awarded to Applied Nanotech will be used to research the use of the company’s CarbAl heat-transfer material in high-power LED circuit boards. According to the company, the “CarAl heat transfer material has a unique combination of low density, … [Read more...]
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