Many engineers have traditionally designed bonding applications to withstand extreme temperatures using the idea that substrate materials and adhesives with similar coefficients of thermal expansion (CTE) will, at a given temperature, change size at the same rate. However, the difficulty of finding substrates and adhesives that have compatible CTEs and meet all application … [Read more...]
Research on Measuring Nanoscale Thermal Conductance May Increase Cooling Efficiency
A research team at the University of Illinois as Urbana-Champaign (UIUC) has developed a new system for examining and measuring nanoscale thermal conductance at the interface between two materials. The scientists believe that with further refinement, the system can be used to harvest electricity from waste heat, increase cooling efficiency of microelectronic devices and target … [Read more...]
Thermoplastic Polyester for Thermal Management in LEDs and Electronic Components
Science-based company Royal DSM has released PET XL-T, a thermoplastic polyester for thermal management in LED lighting systems and automotive electronics components. According to the company, Arnite PET XL-T was developed as an alternative to metals and other high heat resistance (HHR) materials commonly used in automotive electronic applications. The new polyester is based … [Read more...]
Thermally Conductive Liquid Material Designed for Low Component Stress Applications
Electronic components provider Bergquist Company has released Liqui-Form 2000, a liquid formable material with high thermal conductivity designed for applications requiring low component stresses during assembly and ease of rework. Liqui-Form 2000 requires no curing, mixing or refrigeration and has a low volumetric expansion, stable viscosity and natural tack. According to … [Read more...]
New Version of LCP with Additional Fan Option Moves Air More Efficiently
Rittal Corporation, a manufacturer of industrial and IT enclosures, racks and accessories, has released a new version of the company’s Liquid Cooling Package (LCP) with the option of additional fans for moving air more efficiently and with less effort. According to the company, the new version of the LCP “makes the cooling solution more scalable, improves redundancy and reduces … [Read more...]
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