TECA Corporation has introduced the AHP-4250 family of thermoelectric air conditioners. They have a cooling capacity of 3,600 BTU/HR. “Green Zone” styles have efficiencies approaching 100 percent. Both styles come standard with TECA’s eco-mode temperature control design which helps save energy by limiting the need for active cooling when it’s not needed. Like TECA’s other … [Read more...]
Broader Adoption of Vapor Chamber Technology
Cooler Master has announced the broader adoption of Vapor Chamber Technology developed by Cooler Master's OEM and industrial cooling division in its retail Heatsinks. Cooler Master is expanding the TPC series and will equip selected Models of the V series with Horizontal Vapor Chambers. Horizontal Vapor Chambers spread heat eight times faster than solid copper, eliminating hot … [Read more...]
New Heatsink Supports More Package Sizes
Ohmite Manufacturing Company, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has introduced the Ohmite C Series heatsink which now supports most resistor package sizes from TO-126 to TO-264. Ideal for high power density and small size (1U or 2U) electronic packaging with forced convection cooling, the heat sink … [Read more...]
Carbon Fiber Sheet Prototype Challenges Thermal Grease
Sony Chemical & Information Device Corp. displayed a prototype of a sheet whose thermal conductivity it claims is equivalent to that of thermal grease and has a longer life span. The sheet, known as EX20000C, uses a combination of silicon and carbon fibers to produce a thermal conductive layer that is between 0.3 and 2mm thick and has a thermal resistance rating of … [Read more...]
Thermal Endurance Test Procedures Standard
IEC 60034-18-31:2012 describes thermal endurance test procedures for classification of insulation systems used in a.c. or d.c. rotating electrical machines with indirect cooling and form-wound windings. These test procedures are intended to compare the thermal endurance performance of the mainwall insulation between conductor(s) and ground and, where required by the design of … [Read more...]
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