Researchers at MIT have found that relatively simple, microscale roughening of a surface can dramatically enhance its transfer of heat by more than doubling the maximum heat dissipation. To test the process, the researchers made a series of postage-stamp-sized silicon wafers with varying degrees of surface roughness. They found that systematically increasing roughness led to a … [Read more...]
Thermoelectric Air Conditioners with Heat Exchanger Mode
TECA Corp. has introduced two thermoelectric air conditioner models with a heat exchanger mode. They are designed to cool high-heat electronics such as military embedded systems. The heat exchanger mode switches on as the enclosure temperature rises through 25C. and uses 83% less energy than in the active cooling mode. Active cooling and heating is achieved with the use of … [Read more...]
Simplified Data Center Rack Cooling Management
The C degree Flow™ strip from Telect simplifies the managing of data center rack temperatures and increases cooling efficiencies. Using the strip's inherent and bold color-shifting properties, a technician can easily assess data center temperatures and be assured that all is cool. Additionally, temperatures across a rack can be increased by knowing where the cold air is going, … [Read more...]
Microblower Based on Piezoelectric Technology
Murata Americas announced the launch of a microblower that uses a piezoelectric diaphragm, which vibrates up and down when a sine wave voltage is applied. The vibrations force air into the microblower and out through a nozzle on the top of the device. Used as an air pump and capable of creating a high air pressure flow, the pump is ideally suited to shorten the duration … [Read more...]
Improved Thermal Management in Power Semiconductors with LL Packages
StratEdge Corporation, high-performance semiconductor package maker for microwave, millimeter-wave, and high-speed digital devices, launched the LL family of high-power laminate packages. The LL leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high-power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and … [Read more...]
- « Previous Page
- 1
- …
- 212
- 213
- 214
- 215
- 216
- …
- 340
- Next Page »
