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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Liquid Dispensed Thermal Interface Material Filler

 

The Bergquist Company introduced Gap Filler 1000SR, a two-component, room temperature cure, liquid-dispensable thermal interface material that features slump resistance. As dispensed, the material is designed to remain in place and maintain its shape on the target surface, allowing for flexibility in component orientation during assembly. As cured, the soft elastomer provides a … [Read more...]

Thermal Testing Standards for LEDs

 

JEDEC Solid State Technology Association has announced the publication of a new series of standards for component level testing of high-brightness/power LEDs. The new JESD51-5x series of standards is aimed at thermal characterization of power LED components. The standards include clear recommendations for which data to include on LED data sheets, as well as test environments … [Read more...]

Space Exploration and Higher Education Will Both Benefit From New NASA Partnership

 

NASA Goddard has entered into a collaboration designed to enhance the science, technology, engineering and math capabilities within two Historically Black College and University institutions over the course of a three-year program. Professors and students from Alabama A&M University and Tuskegee University will be building a library of electronic designs for future … [Read more...]

Iron-based HTS show Unexpected Electronic Asymmetry

 

While investigating iron-based HTS, researchers from Kyoto University and the Japan Synchrotron Radiation Research Institute found that its electronic properties were different in the horizontal and vertical directions and provide the strongest evidence yet of electronic nematicity in HTS. The study used the parent compound barium iron arsenide and measured electronic … [Read more...]

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