The first commercially available computer system that is cooled with hot water rather than air was unveiled at the Leibniz Supercomputer Centre in Munich. The IBM iDataplex system removes heat 4,000 times more efficiently than air-cooled systems using a new form of IBM’s hot-water cooling technology. It cools active components in the system such as processors and memory modules … [Read more...]
Electronics Cooling June Issue Now Online
Don’t miss out on the June 2012 issue of Electronics Cooling, which includes feature articles on hot spot dissipation, spray cooling , metal foam-PCM heat storage technology, and much more. If you would like to receive your free copy of Electronics Cooling click here to subscribe. Read the June 2012 issue here. Download your copy of the June 2012 issue here. … [Read more...]
Designing Heat Sinks When a Target Pressure Drop and Flow Rate is Known
Forced convention air cooled heat sinks and liquid cooled cold plates are quite pervasive in their use in electronics cooling applications. While there can be significant debate on whether to air or liquid cool a particular component, the approach a thermal engineer would adopt to design both components is essentially similar. Parallel plate fins are the most common geometry … [Read more...]
New Thermo-Fluid Simulation Software for Power and Energy Markets
Mentor Graphics Corporation announced the Flowmaster(R) Power and Energy version for system level thermo-fluid simulation. This new product provides a two-phase solution modeling the phase change from liquid to vapor for steam generation or from vapor to liquid when steam is consumed. The software introduces a complete steam/water Rankine Cycle simulation capability for the … [Read more...]
Research Program Attempts Embedded Cooling
DARPA’s Intrachip/Interchip Enhanced Cooling (ICECool) program seeks to explore embedded thermal management by bringing microfluidic cooling inside the substrate, chip or package by including thermal management in the earliest stages of electronics design. This embedded cooling comes in the form of microchannels designed and built directly into chips, substrates and packages. … [Read more...]
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