May 8 -10, Winterthur Museum & Gardens, Wilmington, Del. From its origins in polyimide materials and processes, The Symposium on Polymers has evolved into a comprehensive technical meeting with a broad focus on organic and polymeric materials with application in all areas of the microelectronics industry - from wafer level through standard and advanced level packaging. · … [Read more...]
SAE 2012 World Congress
April 24-26, Cobo Center, Detroit, Mich. The SAE 2012 World Congress theme, Get Connected, represents the new and diverse connections that will drive significant advancements in the auto industry of tomorrow. Not only does the theme symbolize literal connections, such as those between vehicles, infrastructure, the Internet, and the nation's electrical grid, but also … [Read more...]
Luminescent 'LED-Type' Design Breaks Efficiency Record
Researchers from the University of California, Berkeley have successfully designed a more efficient solar cell that is capable both of emitting light and absorbing it. The development came after researchers examined the reasoning behind why such a large gap existed between the theoretical limit to the amount of electrical energy that can be harvested by a solar cell and the … [Read more...]
Nanoscale Phenomena with Potential for Computer Speed Advances
A team of University of Maryland scientists have discovered that when electric current is run through carbon nanotubes, objects nearby heat up while the nanotubes themselves stay cool. Understanding this completely unexpected new phenomenon could lead to new ways of building computer processors that can run at higher speeds without overheating. The researchers have dubbed the … [Read more...]
Air-to-Air Thermoelectric Cooling Assembly
Marlow Industries announced the availability of a new high-performance air-to-air thermoelectric cooling assembly—Climatherm. The new assemblies provide up to 125 percent greater performance than current air-to-air thermoelectric assemblies, in an exceptionally light and compact package. Marlow’s new cooling assembly provides protection in extreme temperatures and carries IP55 … [Read more...]
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