GE Global Research presented its advanced, dual piezoelectric, thermal cooling jet (DCJ) during a vendor workshop at SEMI-THERM 28. The DCJ, a 1 mm thick, ultra-compact bellows device provides air flow more efficiently than a traditional cooling fan and in less space. Its thin form factor allows for more design flexibility in electronics applications, such as tablets, where … [Read more...]
Interview with SEMI-THERM Founder, Bernie Siegal
Bernie Siegal, the founder of SEMI-THERM, gives a snapshot of the history of the symposium, the current event and the future of SEMI-THERM. … [Read more...]
David Copeland Welcomes You to "The Heat is On" by MEPTEC
Conference chair speaks about "The Heat is On," a mini-conference of SEMI-THERM 28, which deals in the thermal management and packaging of electronic products and devices. The theme was evolutionary and revolutionary trends in the field. … [Read more...]
Range of Diamond Materials Used in Thermal Management Applications
Element Six has developed a range of polycrystalline diamond and synthetic diamond composite materials that can be used in a wide range of thermal management applications. Synthetic diamond is an ideal material for a range of thermal management applications, and has a thermal conductivity four times higher than copper. In addition, the material is an electric insulator. The … [Read more...]
Non-Silicone Thermal Interface Products
AOS Thermal Compounds showcased its thermally conductive interface material, thermal grease and gap filler at SEMI-THERM 28 in San Jose, California. The company’s Micro-Faze®A is a dry-to-touch thermal interface pad formulated with non-silicone thermal grease. It was developed by AOS to offer the low thermal resistance in a thermal interface without the mess of grease. … [Read more...]
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