Don’t miss out on the March 2012 issue of Electronics Cooling, which includes the 2012 Buyers' Guide, feature articles on Iconic Winds: A New Frontier for Air Cooling, Thermal Ground Plane Technology Impacts Electronics Packaging, Enhancement of Microchannel Cooling with Oblique Technology, as well as technical briefs. If you would like to receive your free copy of … [Read more...]
Calculation Corner: Transient Modeling of a High Power IC Package, Part 2
Part 1 can be found here. Part 1 of this article provided the groundwork for the present discussion [1]. It demonstrated the use of three different methodologies for performing a transient thermal analysis of a high-power IC package attached to a heat sink. These include the finite element analysis (FEA) method and a numerical model, which represents the package and heat sink … [Read more...]
High Temperature Felt and Millboard Ideal for Industrial Appliances
Morgan Thermal Ceramics announces the availability of its Superwool® HT™ Felt and Superwool® HT™ Millboard, ideal for fabricating gaskets and heat shields for industrial appliances, including ovens, fryers and cooking equipment. The lightweight, multi-purpose products are available in a full range of sizes, thicknesses and densities and offer equivalent performance to … [Read more...]
Thermal Fuse Series Meets High Current Application Requirements
In response to market demand for applications requiring thermal cut-outs with high current capabilities, Selco Products has introduced the SWTC3 Thermal Fuse Series. The SWTC3 features a 20 Amp rating at 120/250VAC and is suited for use in a wide range of applications. Selco’s new SWTC3 and original SWTC (10 Amp continuous duty rated) thermal cutoffs are designed to provide … [Read more...]
Thin Label Material Made of 0.5 Mil Polyimide Film
Polyonics has designed an ultra-thin, white coated, polyimide label material that uses a 0.5 mil film for space constrained electronics. The XF-616 is a high temperature, thermal transfer printable material with an aggressive acrylic adhesive to insure superior bond permanence. This label material is designed to provide a 20% lower profile and survive the harsh environments of … [Read more...]
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