Product: EP29LPTCHT Release Date: 11/21/2019 Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle … [Read more...]
Low Compression Force Sarcon
Carteret, NJ — The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and fragile solder joints … [Read more...]
Europe Data Center Cooling Market Size to Exceed $6 Billion by 2024
According to the Graphical Research new growth forecast report titled “Europe Data Center Cooling Market Size By Component (Solution {Chilling Unit, Air Conditioner, Cooling Tower, Control System, Economizer, Liquid Cooling System}, Service {Consulting, Maintenance & Support, Installation & Deployment}), By Cooling Technique (Rack/Row Based, Room Based), By Application … [Read more...]
125-19(SP)C-A Flexible, Non-flammable, High Conductive Temperature Resistant Conductive Ink and Coating
Ayer, MA, October 2019 Creative Materials introduces 125-19(SP)C, a flexible, non-flammable, high temperature resistant conductive ink and coating. This product features excellent bonding to most metal and plastic substrates and has the unique characteristic of bonding well to silicone. A key advantage of this product is that it is non-flammable, in contrast to most products … [Read more...]
Schneider Electric Announces Partnership with Avnet and Iceotope to Develop Liquid-Cooled Data Center Solutions
BARCELONA, Spain, Oct. 2, 2019 /PRNewswire/ -- Schneider Electric, the leader in digital transformation of energy management and automation, announced today that it is teaming up with Avnet and Iceotope to jointly develop innovative, chassis-level immersive liquid cooling solutions for data centers. This newly announced partnership brings together three global technology … [Read more...]
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