Sponsor

Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

Sponsor

Yale Engineers Invent Magnetic Fluid Pump with No Moving Parts

 

In a study published today in Physical Review B, Yale electrical engineering professor Hur Koser and colleagues from the University of Georgia and Massachusetts Institute of Technology demonstrate for the first time an approach that allows ferrofluids to be pumped by magnetic fields alone. Their approach could lead to highly compact, integrated, quiet, and efficient liquid … [Read more...]

Call for Papers: 62nd ECTC

 

Oct. 10 Mark your calendars! October 10, 2011 is the deadline to submit an abstract and/or a Professional Development Course (PDC) proposal about new developments and technology related to the following: Advanced Packaging Applied Reliability Assembly and Manufacturing Technology Electronic Components & RF Emerging Technologies Interconnections Materials & … [Read more...]

Electronics, Solar Energy and New Technologies

 

Sept. 27, Marlborough, Mass. Alternative energy, in particular solar PV, is a major growth area for new companies, materials companies, equipment suppliers and EMS providers in the electronics industry, both in the panels and balance of plant manufacture. Despite recent painful bankruptcy filings by prominent solar PV companies, there is solid growth and strong government … [Read more...]

Low Compression, High Performance Thermal Gap Filler

 

Fujipoly’s new Sarcon® GR-SL is a low compression and high-performance thermal gap filler material.  When placed on top of uneven components, this material quickly conforms to all gaps, peeks and air pockets making a level, large surface area contact point. The high degree of physical contact allows the heatsink to more efficiently remove unwanted heat. As Fujipoly’s softest … [Read more...]

Industry Sponsors

Sponsor
Sponsor