Rogers Corp. has introduced TC350 Plus laminates. TC350 Plus laminates are ceramic filled PTFE-based woven glass reinforced composite materials providing a cost effective, high performance, thermally enhanced material for the circuit designer. With a thermal conductivity of 1.24W/mK, this next generation PTFE-based laminate is ideally suited for higher power microwave and … [Read more...]
New Diafilm TM220 from Element Six Offers Thermal Conductivity in Excess of 2200W/mK
At the 2019 International Microwave Symposium (IMS) Element Six, part of the De Beers Group, launched a new diamond thermal material grade designated Diafilm TM220. Said to be the world’s first diamond thermal material engineered to offer industrial users thermal conductivity in excess of 2200 W/mK, Diafilm TM220 was developed in response to the increasing demand for more … [Read more...]
Molex QSFP-DD BiPass Module Cooler Helps Designers on the Path to 112 Gbps PAM-4
As industry prepares for the launch of next-generation copper and optical QSFP-DD transceivers, thermal management strategies are critical. The new Molex QSFP-DD thermal solution can cool a range of 15W to 20W in different configurations with a 15 degree Celsius change from ambient temperature. In data centers and telecommunication infrastructure, 56 and 112 Gbps … [Read more...]
Are Power Electronic Modules a New Growth Opportunity for Conductive Pastes?
Power electronics is a growing market thanks to the electrification of many industries such as the automotive industry. The power electronic modules being used are growing in performance; in particular, they are becoming smaller, lighter weight, more tightly integrated, and better able to handle higher power levels. In some cases the semiconductor technology is also shifting … [Read more...]
Thermal Gap Filler Reduces Stress on Sensitive Components
Laird Performance Materials has introduced the Tflex HD80000, a high deflection thermal gap filler combining 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination allows minimal stress on sensitive components within a device while also yielding low thermal resistance. As a result, less mechanical and thermal stresses are … [Read more...]
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