(a) A nanostructured interface material is used around the module; (b) a nanostructured interface material is used between the thermoelectric material and metal leads. Semiconductor Research Corporation (SRC) and researchers from Stanford University have developed a novel combination of elements that yields a nanostructure material for packaging. The advance could mean … [Read more...]
New Thermoelectric Module for Photonics Cooling
Nextreme Thermal Solutions recently introduced the OptoCooler HV37 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address photonics cooling applications with larger heat pumping requirements. At 85°C, the OptoCooler HV37 can pump 4.5 watts or 107W/cm2 of heat in footprint of only 6 mm2. The device is only 0.6mm … [Read more...]
Novel Thermally Enhanced Power Package
In this paper from Texas Instruments, the authors present a novel power package design that enables heat conduction to the top surface of the microelectronic package through the use of a high thermal conductivity path which reduces by more than a factor of ten the junction-to-top thermal resistance compared to standard solutions. The paper discusses the design, … [Read more...]
Testing Thermal Interface Material (TIM) Analysis
2-3 p.m., March 10 This webinar will provide an introduction to the most commonly used Thermal Interface Material (TIM) types and their corresponding testing techniques. Basic TIM properties such as bulk or effective thermal conductivity, interfacial thermal resistance and bond line thickness will be explained. At the beginning, an overview of the existing industrial and … [Read more...]
DesignCon 2011
Feb. 1-2, Santa Clara Convention Center, Santa Clara, Calif. Tracks include Chip-Level System Design and Verification, High-Speed Signal Processing, Equalization and Coding, Power Integrity and Power Distribution Networks, Electromagnetic Compatibility and Interference, Test and Measurement Methodology, RF and Microwave Signal Integrity, Analog and Mixed-Signal Design and … [Read more...]
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