Purdue University researchers, led by Suresh V. Garimella, have developed a new design employing carbon Nanotubes and small copper spheres that wicks water passively towards hot electronics that could meet the challenges brought on by increasing frequency speeds in chips. The researchers came up with a design that uses water as the coolant liquid and transfers the water to an … [Read more...]
Light Tack Adhesive Eases Fitting of Thermal Interface Pads
MH&W International now provides U 90 silicone-free thermal interface materials with a new light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads, and allow their easy positioning between components and heat sinks. MH&W’s Keratherm U 90 thermal interface material is a ceramic-filled … [Read more...]
Embedded Wafer-Level-Packages
Yole Developpement has released its new report on Embedded Wafer-Level-Packaging. This analysis covers both Fan-Out WLP technology development and Chip embedding into PCB laminated substrates. These two infrastructures are emerging at the same time and ramping to high volume production. Key features of the report “Embedded Wafer-Level-Packages: Fan-out WLP / Chip Embedding in … [Read more...]
New Catalog Released
Fujipoly announces an Aug. 16 release date for its new Thermal Interface Material and Elastomeric Connector product catalog. The free 52-page product overview and technical design guide includes installation suggestions, as well as detailed thermal performance and electrical conductivity data points. Several new pages of high-performance and low-cost thermal materials have … [Read more...]
Ultra-Thin Waterproof Piezoelectric Speaker
Murata Electronics North America recently launched an ultra-thin waterproof piezoelectric speaker. With a thickness of only 0.9mm, this 19.5mm x 14.1mm speaker enables greater design freedom for the rapidly growing and evolving mobile market. The speaker achieves IPX7 grade waterproof protection without the need of a waterproof acoustic membrane. Using acoustic mesh and … [Read more...]
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