Intel Corporation has unveiled its newest Intel® Atom™ processor-based platform. The technology package provides significantly lower power consumption and prepares the company to target a range of computing devices, including high-end smartphones, tablets and other mobile handheld products. The platform has been repartitioned to include the Intel Atom processor Z6xx, which … [Read more...]
ElectronicsCooling Spring 2010 Print Issue
Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in the economy as a whole, and specifically within the electronics thermal management community, we can hope that this is a sign of improvement and recovery. We will … [Read more...]
Miniature Environmental Control Unit for Electronics
Aspen Systems has completed the development and military qualification of ECU-Chill™, a ruggedized refrigeration-based environmental control unit (ECU) for cooling electronics in mobile applications. ECU-Chill™ maintains sealed electronics enclosures at or below ambient temperatures, enabling Commercial-Off-The-Shelf (COTS) electronics to be safely and effectively used for … [Read more...]
Thermally Conductive Printed Circuit Board Substrate
Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 … [Read more...]
Evaluation Method for Thermoelectrical Cooling Systems
IEC/TS 62610-3 ed1.0 -- Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect). IEC/TS 62610-3:2009(E) provides an evaluation method for thermoelectrical cooling systems (Peltier effect). With this design … [Read more...]
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