VTMS 13: Vehicle Thermal Management Systems May 17-18, 2017 London, UK "In order to reduce emissions and make all vehicles more efficient, VTMS 13 will showcase the latest research and technological advances in heat transfer, energy management, thermal comfort and the efficient integration and control of all thermal systems within the vehicle." Read more here. … [Read more...]
Thermal Design & Cooling of Electronics Workshop
Thermal Design & Cooling of Electronics Workshop 7 – 9 November 2016 Eindhoven, the Netherlands Experienced lecturers Wendy Luiten (winner of the Prestigious Harvey Rosten Award 2014) and Clemens Lasance (SEMI-THERM THERMI Award winner in 2001) teach the participants how to solve the thermal problems they encounter during all levels of the product creation process. They … [Read more...]
Comparison of Heatsinks used for the Thermal Management of LEDs
By James Pryde1,2, Weeratunge Malalasekera1, and David Whalley1 1Loughborough University 2Tamlite Lighting Introduction The work of Kraus & Bar-Cohen [1] and Bar-Cohen et al. [2] provide a well-defined foundation for the design and optimisation of conventional heatsinks. However, advances in manufacturing processes and increasing access to simulation tools provide new … [Read more...]
High-Performance Circuit Materials Exhibited at Upcoming Conference
Rogers Corporation will exhibit its high-performance circuit materials at the PCB West 2016 Conference and Exhibition, booth 201. Designed to dissipate heat in high-power applications, thermally enhanced 92ML laminates and prepregs are halogen-free, flame-retardant, thermally conductive epoxy-based thermoset materials that provide a lead-free-solder-compatible solution for … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
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