CENTUM® C3 Chips are designed for higher performance low profile architecture of solid-state thermal management systems that is not possible with current designs Sheetak is expanding their flagship CENTUM® product line, based on newly patented thermoelectric device structures, that offer the highest temperature difference with significant increases to cooling power and … [Read more...]
Advanced SAM Validates Integrity of Diffusion Bonds
For bond quality testing, Scanning Acoustic Microscopy offers far greater accuracy and reliability than traditional helium leak testing Introduction Industries with demanding metal bonding applications are increasingly relying on diffusion bonding, an essential joining method for achieving a high-purity interface between two similar or even dissimilar metals. The process … [Read more...]
Laird Thermal Systems Unveils Micro Multistage Thermoelectric Cooler & Optical TEAs Integration Capability
Designed for miniature optical packages, the MSX Series micro thermoelectric coolers deliver deep cooling that maximizes image resolution in high-performance image sensing applications… June 27, 2023 – Laird Thermal Systems has developed the new OptoTEC™ MSX Series of micro multistage thermoelectric coolers and the capability to integrate them into various optical … [Read more...]
Hydraulic and Thermal Characteristic of a Double-Sided Cold Plate. Part 1: CFD Analysis
Introduction Many programs geared toward the design of autonomous vehicles have been initiated in recent years. Waymo, Cruise, Baidu, Argo AI, Uber, Lyft, and Tesla are among the innovative self-driving car companies. Advances in autonomous technologies will require enhanced thermal protection of critical electronics to ensure optimized performance, health, and … [Read more...]
Generative Design and Advanced 3D Printing: A Copper CPU Cooler with 55% Lower Thermal Resistance
Introduction Effective cooling is essential for CPUs, as they generate significant heat during operation while being very temperature sensitive. Improved cooling allows for maintaining the functionality of high-performance computer hardware. In this article, we demonstrate a unique approach to improving the cooling of high-performance components by combining thermal and … [Read more...]
- « Previous Page
- 1
- …
- 3
- 4
- 5
- 6
- 7
- …
- 340
- Next Page »
