The Critical Power Expo has recently released their report and webinar on “Key Trends on the Design and Operation of Power Systems for Mission-Critical Environments” free and on-demand. The exclusive report explores the key trends that are emerging in provision of power systems for mission-critical facilities across multiple industries, and is accompanied by the one-hour … [Read more...]
Aerospace Electronics Simulation Seminar
Aerospace Electronics Simulation Seminar August 24, 2016 Online Learn about the challenges faced by avionics designers and how 6SigmaET addresses these with an ATR chassis case study. To register, click here. … [Read more...]
ITherm 2017
ITherm 2017 May 30 - June 2, 2017 Walt Disney World Swan & Dolphin Hotel, Lake Buena Vista, Florida Sponsored by the IEEE's CPMT Society, ITherm 2017 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2017 will be held along … [Read more...]
Temporary Bonding Adhesive for Thin Wafer Handling Introduced
AI Technology has developed specialized tools and equipment to handle thin wafers and thin reconstituted wafers. A series of temporary bonding materials can process temperatures up to 150 Cº, and are well accepted for grinding, dicing, etching, and deposition. AIT’s high temperature wafer processing adhesives (WPA) handle higher temperature processing, and can withstand … [Read more...]
IC Coolers for Limited-Space Requirements
Jaro’s new IC Coolers are ideal for limited-space requirements and designed with BGA, graphic, embedded processors and other IC packages in mind. They are intended for PCMCIA, PCI express cards, blade servers, and all hot chip sets. The V6X090 model (70 x 58 x 12mm) offers 70,000 hours MTBF, with a very quiet operation. The IC Coolers are powerful, lightweight, open-fin, and … [Read more...]
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