(August 8, 2016) The minimum efficiency standards for general-purpose, three-phase motors have been raised. “The U.S. Department of Energy (DoE) recently released new efficiency standards for commercial and industrial pumps that are based on efficiency levels negotiated by manufacturers, efficiency advocates, and other stakeholders,” reported MachineDesign.com, “In addition to … [Read more...]
Ultra-Thin Thermoelectric Cooler Provides Precise Temperature Control for Optical Electronics
Phononic recently announced its pico-TEC series, a high-performance solid-state thermoelectric module (TEM) designed to provide precise temperature control in order to meet the unique thermal management requirements of optoelectronics and fiber optic modules. The pico-TECs are manufactured using advanced automated semiconductor fabrication technology and ultra-thin form factor … [Read more...]
New Power Supply Units Introduced
SilverStone’s Strider Platinum series has two new additions, the ST1000-PT and ST1200-PT units. Along with being the world's smallest 80 PLUS Platinum, fully-modular ATX power supplies, the ST1000-PT and ST1200-PT units are two of six, all with capacities ranging from 550W to 1.2 kW. Both new high-end Strider Platinum units have restricted dimensions, with only 18cm depth, and … [Read more...]
Thermal Conductor Research Project Joined by UH Physicist
(July 21, 2016) University of Houston’s MD Anderson Professor and physicist, Zhifeng Ren, has joined the $7.5 million collaboration to develop a material with a higher conductivity than diamonds. “Earlier research conducted in this field has anticipated the potential of boron arsenide to be a better thermal conductor than diamonds,” said Ren, “David Broido, a Boston College … [Read more...]
New Thermally Conductive Interface Material Announced
Noelle Industries, a division of Creative Materials, Inc, has recently introduced their new thermally conductive interface material, the 804-24. The 804-24 is a one-component thermal grease that has excellent heat dissipation properties, low sag, and no bleeding. It is designed to dissipate heat away from electronic components such as semiconductors and temperature sensing … [Read more...]
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