Chomerics Europe, a division of Parker Hannifin, has recently revealed a new thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommunication, IT, and automotive applications, THERM-A-GAPTPS60. “THERM-A-GAP TPS60 comprises a soft (Shore 00-35) silicone matrix filled with thermally conductive … [Read more...]
New Refrigerant-Based Rack and Row Cooling Solution for IT Equipment
Rittal Corporation has recently introduced a new refrigerant-based rack and row cooling solution, LCP DX, for heat removal of critical IT components. The Rittal Rack LCP DX “puts the cooling only where needed to protect valuable IT equipment while minimizing energy costs” and “includes air-flow optimized enclosures with includes baffles and blanking panels,” said the … [Read more...]
Overcoming Cooling Challenges Downloadable Webinar Now Available
The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download. Exploring ‘invisible elements’ like airflow and heat transfer, speaker Jim Byrne talks through how to maximize product performance by overcoming common electronics challenges like reduction in product … [Read more...]
Registration for Thermal Conference Opens
ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. According to the … [Read more...]
Cooling High-Powered Electronics with Tiny Drops of Water
Lockheed Martin and the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) want to cool high-powered microchips with microscopic drops of water. “A core team of Lockheed Martin engineers is working on a solution to meet the goal of DARPA’s Inter/Intra Chip Enhanced Cooling (ICECool) program: to enhance the performance of RF MMIC power … [Read more...]
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