This article reviews integration approaches and, by employing finite element analysis (FEA), compares thermal management solutions for the combined electric motor and power electronics systems for electric vehicles. Integration of power electronics into the electric motor helps achieve higher power densities in the electric traction drive systems. The benefit of integration … [Read more...]
Electric Motor Thermal Management for Green Transportation
Introduction Stringent greenhouse gas-emission legislations have accelerated the electrification of ground and air transportation. Since the electric motor is one of the core components of the electric drivetrain, improving its performance is a key enabler to better performance metrics of an electric drivetrain, i.e., higher power and torque density, better fuel economy (lower … [Read more...]
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
In this video demonstration, learn more about EP3HTSDA-1, a thermally conductive die attach epoxy, and see how easily it dispenses. One component Master Bond EP3HTSDA-1 is formulated primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids … [Read more...]
Emerging 5G Networks: Potential Economic Benefits of Two-Phase Thermal Management
The fourth and future industrial revolutions will set new requirements for smart cities / factories, autonomous vehicles, augmented reality, smartphones, etc., resulting in more distributed architectures, expanding the convergence of new technologies and developments thus, transforming the term Internet of Things (IoT) to Internet of Everything (IoE). Centralized cloud … [Read more...]
Thermal Quality Assessment of Semiconductor Components
Introduction Reduction in early life failures and continuous quality improvements are “table stakes” for semiconductor manufacturers servicing the automotive industry. “Industry analysts expect that the automotive semiconductor market will be the fastest growing end use market for chips from 2017–21, with a 6.4 percent CAGR and a total market value of between $39-42 billion … [Read more...]
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