JEDEC Thermal Standards: Developing a Common Understanding The Joint Electron Device Engineering Council (JEDEC) was established to provide recognized technical standards for a wide range of applications, from how to handle electronic packages and defining package outline drawings, to the methods used to characterize performance, including thermal. The JC-15 committee … [Read more...]
About the Author
Jesse Galloway
Jesse Galloway is a member of the technical staff at ON Semiconductor. He supports advanced package reliability along with thermal and mechanical characterization. His specialties include thermal and mechanical simulation and experimental measurements related to reliability. He has worked in the electronics package industry for more than 25 years. Jesse currently lives in Phoenix, AZ and enjoys hiking and bicycling.
Developing a Thetajc Standard Under Steady-State Testing Conditions
ABSTRACT Testing standards provide a common framework for collecting and reporting data. Without a clearly defined testing standard, it is impossible to compare experimental data measured by different labs since differing test conditions may mask the very effect being tested. For this reason, a Thetajc standard is needed to specify testing conditions that allow for an … [Read more...]
Lidded Versus Bare Die Flip Chip Package: Impact on Thermal Performance
Thermal design and material selection continues to be a concern for electronic packages, particularly for flip chip ball grid array packages (FCBGA). Lower cost package options are available today, which are finding applications in high power design spaces that previously only employed copper lid heat spreaders. Exposed die flip chip packages are used frequently in lower power … [Read more...]
