Jim Wilson ElectronicsCooling magazine provided a technical data column from 1997 to 2009 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. The most common materials and their associated thermal properties used in electronics packaging were covered. Table 1 lists a summary of the technical data columns divided … [Read more...]
We are back – and in print
Did you miss us? For those of you that are faithful readers of ElectronicsCooling, I am pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in the economy as a whole, and specifically within the electronics thermal management community, we can hope that this is a sign of improvement and recovery. We will … [Read more...]
Giving Back
haring, Tech nical knowledgeThe A&D group represents a large number of subscribers but their contribution rate measured against authored articles in ElectronicsCooling is underrepresented. Soliciting targeted articles from my coworkers within this industry group has proved difficult. I understand some of the reasons for the lower number of submissions but contend that there … [Read more...]
Heat of Vaporization
Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data column and the topic for this issue is liquid to vapor phase change. The energy required to change a substance from a liquid state to a vapor state is … [Read more...]
en Route to a Greener Thermal Technology
It's no surprise. Power levels in the data center keep rising. In fact, the cost of powering the computers in the data center is beginning to exceed the cost of the computers themselves. The computer architects have responded by designing systems that use multi-core processors. These processors can use less energy to perform the same workload as their single-core brethren by … [Read more...]
