Phil Tuma 3M Company, St. Paul, Minnesota The inefficiencies of legacy datacenter air cooling schemes are by now well known. New “Free Air” cooling technologies in which air is introduced to the racks in a facility or container and confined in hot and cold plena probably represent the pinnacle of air cooling efficiency, at least where climate permits them. However, development … [Read more...]
Indirect Thermosyphons For Cooling Electronic Devices
Nomenclature Variables R Thermal Resistance [°C/W] or [°C-mm2/W] Q Power [W] Q" Heat Flux [W/cm2] T Temperature [°C] or [K] h Heat Transfer Coefficient [W/cm2-K] Subscripts sat saturation tc thermocouple s sink or boiler w wall j junction layer of die a ambient f fluid or saturation c chip surface boil associated with … [Read more...]
