Robert Simons Editor-in-Chief, Winter 2010 Issue Resolutions As you read this editorial we are fast approaching the end of another year. For some, this is a time for introspection. Who has not, at sometime, looked back at the past year in their personal life, maybe reflecting upon what they accomplished, would have liked to accomplish, and what they did not accomplish? If you, … [Read more...]
Using a Matrix Inverse Method to Solve a Thermal Resistance Network
Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a project, when the thermal engineer finds it advantageous to perform so called "back of the envelope" calculations without resorting … [Read more...]
A Simple Method to Estimate Boiling Heat Sink Performance
Introduction As most readers of ElectronicsCooling magazine are no doubt aware, fins may be added to a heat transfer surface to increase the effective heat transfer area and thereby reduce the base surface temperature for a given heat load and heat transfer coefficient. The formula to estimate the heat dissipation capability, qf, of a straight fin is given by, and Af is … [Read more...]
Reader Poll Declares ElectronicsCooling a Winner!
Reader Poll Declares ElectronicsCooling a Winner! Here in the United States we are in the midst of the campaign season leading to our national election in November to choose our next president. While Senator John McCain is the clear winner of the Republican nomination for president, as I draft this column, the contest between Senators Hillary Clinton and Barack Obama to win the … [Read more...]
Estimating Dew Point Temperature For Water Cooling Applications
Over the past several years thermal engineers and others in the computer industry have become acutely aware of the challenge of increasing power dissipation and the potential of liquid (principally water) cooling to provide a thermal management solution. A number of articles in ElectronicsCooling have addressed both the issue of increased power dissipation [1-4] and various … [Read more...]
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