Although most of the emphasis today in the electronics cooling community is devoted to extending forced convection cooling capability, many applications still depend upon natural convection cooling. Basically, natural convection cooling combined with radiation is what results when a fan is not used in the cooling design to move air. Instead, movement of the air is induced by … [Read more...]
Application of Thermoelectric Coolers for Module Cooling Enhancement
Figure 1. Cooling power density for different T.E. cooler designs (adaped from Vandersande and Fleurial [6]). Introduction Many advances in computer technology have been made possible by increases in the packaging density of electronics. These advances began with the introduction of the transistor in 1947 and continue today with ultra-large scale integration at the chip level … [Read more...]
A simple method to estimate heat sink air flow bypass
Introduction After selecting or designing a heat sink based upon a given air velocity orvolumetric flow rate through the fins, the thermal designer needs to determinethe total amount of flow which must be delivered in the duct or card passagecontaining the module w with heat sink. As shown in Figure 1, some of the flowwill go around or bypass the heat sink. In fact, depending … [Read more...]
Direct liquid immersion cooling for high power density microelectronics
Introduction Since the development of the first electronic computers in the 1940s, thedevelopment of faster and denser circuit technologies and packages has beenaccompanied by increasing heat fluxes at the chip and package levels. Over theyears, significant advances have been made in the application of air coolingtechniques to manage increased heat fluxes. Although air cooling … [Read more...]
- « Previous Page
- 1
- …
- 3
- 4
- 5
