The simplest of compact thermal models (CTMs) is a one resistor type. Of these the most widely quoted is Theta_ja (ok, ok, and Theta_jma, more on that variant later). Knowing the power dissipation of the component as well as the ambient temperature is in theory all that is required to determine the junction temperature from the supplied Theta_ja resistance value. You would … [Read more...]
So, you want to predict component temperatures do you? Part II
Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature. Some indication is better than none but I wouldn’t bet on it, really, I wouldn’t. Accurate case and junction temperature prediction can only be realised with either a fully 3D detailed representation or an abstracted CTM … [Read more...]
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