Introduction IBM announced its return to water cooling on April 19, 2005 with the introduction of a water cooled heat exchanger mounted to the back cover of a 19 inch rack. This is the first of the major datacom equipment manufacturers to employ water cooling for a rack of CMOS processors, using a cooling distribution unit supplying the water and rejecting the heat load to … [Read more...]
Hot Spots in Data Centers
Heat loads of data processing equipment continue to increase at a rapid rate. This increasing heat load has been documented by a Thermal Management Consortium of 17 companies [1] as shown in Figure 1. Also shown in this figure are measured heat fluxes (based on product footprint) of some recent product announcements. The most recent shows a rack dissipating 28,500 watts, … [Read more...]
Use of Naphthalene Sublimation Technique for Obtaining Accurate Heat Transfer Coefficients in Electronic Cooling Applications
The naphthalene sublimation technique has been demonstrated by a number of investigators to be an excellent method for obtaining heat transfer results [1,2] and a few have applied this technique to applications focused on electronic cooling [3-6]. These investigators have found that the mass transfer process can be set up with cleaner boundary conditions and can be studied more … [Read more...]
Low temperature electronic cooling
The potential for low temperature enhancement of CMOS performance has been recognized for some time, going back as far as the late 1960's and mid-1970's. A collection of articles focusing on low temperature electronics is included in the book by Kirschman(1) where a number of researchers [2-6] have identified the advantages of operating electronics at low temperatures. Jaeger … [Read more...]
