Thermal management of electronic equipment is a dynamic process. For example, the anticipated power trends for CMOS technology can be found in the roadmaps of [1 and 2]. They closely follow the rapidly rising power trends seen in the 1980s for the bi-polar circuits [3] but with a time shift by a decade. It is a fortunate circumstance that a tremendous amount of heat transfer … [Read more...]
Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example
Fig. 1: Levels in a computer environment. Introduction Increasing demands for higher performance in microprocessors have a direct effect on chip power and heat generation. Increased function and miniaturization of the packages result in thermal challenges that require a thorough understanding of the system's thermal performance under all possible field conditions. Regardless … [Read more...]
