Introduction Vapor chambers are passive two-phase devices used to spread heat from localized hotspots to larger surface areas. The device utilizes the latent heat of evaporation of an internal fluid to passively transport heat from the evaporator (heat source) to the condenser (heat sink) across very low-temperature drops. Condensed liquid returns to the evaporator from the … [Read more...]
Micropumping Technologies for Electronics Cooling
Introduction Traditional cooling approaches, consisting typically of external air-cooled heat sinks, are increasingly falling short in meeting the thermal management challenges of emerging electronic systems. Integrated cooling designs are being investigated to eliminate some of the interface contact resistances introduced by add-on heat sinking and to minimize package … [Read more...]
Prediction of Thermal Contact Resistance
All engineering surfaces exhibit some level of microscopic roughness. The resistance to heat flow through a contact interface occurs because only a small portion (usually 1-2%) [1] of the nominal surface area is actually in contact. Heat may pass through the interface via three paths: conduction through the contact spots, conduction through the gas present in the gap between … [Read more...]
