An innovative process is reducing diffusion bonding time of aluminum and aluminum alloys by up to 50%, energy use by 30%, and improving quality. Contract manufacturers and design engineers in the aerospace, semiconductor, high-power electronics, and energy industries have been turning to diffusion bonded metals to produce new cutting-edge innovations. Diffusion bonding is … [Read more...]
Pfannenberg USA Introduces PTF 1200 High CFM Top-Mounted Filter Fan
Lancaster, NY – Pfannenberg, Inc., a global leader in thermal management and signaling technologies, proudly introduces the PTF 1200, an industry leading high CFM top-mounted filter fan designed to redefine cooling solutions for various industries. This compact yet powerful innovation boasts an unimpeded airflow rate of up to 589 CFM, making it a game-changer in the realm of … [Read more...]
Summary of SEMI-THERM 40 Conference
The SEMI-THERM 40 Symposium was held March 25-28, 2024 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Alex Ockfen (Meta), Program Chair dr. Lieven Vervecken (Diabatix), and Program Vice Chair dr. Navid Kazem (Arieca). It featured a variety of activities including technical short courses, technical sessions, invited presentations, vendor … [Read more...]
Theta-JC Measurements: Steady-State Compared to Transient Methods
Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of electronic packages is controlled, in part, by ensuring the maximum junction temperature is not exceeded during operation. Systems such as cell phones, electric vehicles and computers, must operate with die temperatures … [Read more...]
A Non-Contact Measurement Method for Thin Vapor Chambers by Photonic Technologies
Introduction In recent years, integrated circuit chips have enabled increasingly powerful computing capabilities as advanced process nodes have moved from DUV (deep ultra-violet) to EUV (extreme ultra-violet) lithography, allowing for higher fabrication resolution and transistor density. Additionally, advanced multi-die packaging has seen increased market demand. As a … [Read more...]
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