Abstract The utility of the laser flash thermal conductivity measurement can be greatly expanded to more complex structures by modeling laser flash results using Finite Element Models. This approach is illustrated using a test fixture with 4 heat sinks, where heat spreading is a significant factor. If traditional 1D thermal diffusion models for laser flash are used, thermal … [Read more...]
Thermal Penalties of Bandwidth Enhancements for Li-Fi Communication
The rapid increase of device connectivity, coupled with constantly growing data transmission rates, increases the demand for new communication channels. Illumination systems employing Light Emitting Diodes (LEDs) have the potential to fulfill this demand. LEDs are versatile components that are used as a light source in a vast number of products: indoor and outdoor lighting, … [Read more...]
Calculating Thermal Design Power for Mobile Consumer Electronics – Part 1
Thermal Design Power (TDP) is a term commonly used in the thermal management of consumer electronics. While the usage of this terminology may vary across the industry, it commonly refers to the amount of power that a device may dissipate indefinitely, in a given thermal environment, without exceeding the temperature limits of the device. The TDP for a consumer electronics … [Read more...]
Summary of the IEEE ITherm 2022 Conference
The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Sheraton Hotel & Marina in San Diego, CA, May 31 – June 3, 2022. This was the 21st ITherm, which was first held in 1988. The conference was historically held every other year until 2016 when it switched to an annual schedule. ITherm 2022 was sponsored by … [Read more...]
Calculating Interface Resistance
Introduction The exposed surface area of many of today’s high-powered electronic packages is no longer sufficient for the removal of the heat generated during normal operation. Heat sinks are a commonly-used, low cost means of increasing the effective surface area for dissipating heat by means of convective air cooling. While the use of a heat sink lowers the fluid-side … [Read more...]
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