The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Sheraton Hotel & Marina in San Diego, CA, May 31 – June 3, 2022. This was the 21st ITherm, which was first held in 1988. The conference was historically held every other year until 2016 when it switched to an annual schedule. ITherm 2022 was sponsored by … [Read more...]
Calculating Interface Resistance
Introduction The exposed surface area of many of today’s high-powered electronic packages is no longer sufficient for the removal of the heat generated during normal operation. Heat sinks are a commonly-used, low cost means of increasing the effective surface area for dissipating heat by means of convective air cooling. While the use of a heat sink lowers the fluid-side … [Read more...]
Thermal Modeling of a Silicon Germanium (SiGe) Radio Frequency Integrated Circuit (RFIC) for Wireless Communications
The creation, transport and storage of digital information are growing at rates of 40% to 50% annually, with video, mobile broadband, and machine-to-machine communication being the main drivers. The implementation of 5G wireless networks is enabling this growth and heralding a new era of revolutionary applications and functionality due to bandwidth increases and communication … [Read more...]
Statistics Corner: Modifying Sample Size
ABSTRACT Reliability verification often requires that a specific number of components be tested to a predetermined level of testing to demonstrate that none of the samples fail. This article describes a statistical approach for justifying the use of fewer samples by subjecting them to a more severe level of testing. BACKGROUND Reliability verification often includes … [Read more...]
Thermal Comfort Considerations for Electronics Cooling and Design
Written by: Mark Hepokoski, ThermoAnalytics and Alex Ockfen, Meta Reality Labs Introduction ASHRAE defines thermal comfort as “that condition of mind that expresses satisfaction with the thermal environment” [1]. While engineers and designers are typically familiar with the thermal safety and compliance standards required in their industry [2], thermal comfort is less well … [Read more...]
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