Since the size of electronic components keeps on decreasing, the need for improved heat dissipation on these components keeps increasing. This dichotomy presents thermal engineers with a formidable challenge: how to design smaller coolers that dissipate more heat. Adding to the challenge, the fast-paced evolution of electronics means that the development time for the new cooler … [Read more...]
Generative Design for Electronics Cooling
Co-Authored by: Danny J. Lohan, Yuqing Zhou, and Ercan M. Dede Toyota Research Institute of North America INTRODUCTION Generative design is an iterative design process that involves the use of a program to generate a set of optimized designs that meet product performance requirements and constraints. Methods that transform statements of performance requirements into … [Read more...]
Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards
Master Bond EP77M-FMed is a two part epoxy adhesive and sealant designed for use in the assembly of medical devices. It meets the ISO 10993-5 requirements and is not considered to have a cytotoxic effect. “This product has been formulated to provide excellent electrical and thermal conductivity properties, while keeping in mind processing constraints for heat sensitive … [Read more...]
Techsil & Panacol Offer a New Adhesive for Filament Winding Processes
The newly developed Vitralit® UD 1405 adhesive is an innovative adhesive system for fibre and filament winding. For high efficiency, Vitralit® UD 1405 can be applied during the winding process and immediately cured with high intensity LED curing systems. This adhesive and curing system is ideal for Carbon or Glass Fibre filament winding associated with Carbon Fibre Reinforced … [Read more...]
Heat-Blocking Defects Detected Acoustically
In the landing gear control module of an aircraft, a high-voltage IGBT is about to fail. In the solder bonding one chip’s ceramic base to its heat sink are three small air bubbles—voids, in the vocabulary of electronic failures. The three voids are close together, and the largest is almost directly under a hot spot on the die. Collectively the voids have diminished … [Read more...]
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