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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards

 

Master Bond EP77M-FMed is a two part epoxy adhesive and sealant designed for use in the assembly of medical devices. It meets the ISO 10993-5 requirements and is not considered to have a cytotoxic effect. “This product has been formulated to provide excellent electrical and thermal conductivity properties, while keeping in mind processing constraints for heat sensitive … [Read more...]

Techsil & Panacol Offer a New Adhesive for Filament Winding Processes

 

The newly developed Vitralit® UD 1405 adhesive is an innovative adhesive system for fibre and filament winding. For high efficiency, Vitralit® UD 1405 can be applied during the winding process and immediately cured with high intensity LED curing systems. This adhesive and curing system is ideal for Carbon or Glass Fibre filament winding associated with Carbon Fibre Reinforced … [Read more...]

Heat-Blocking Defects Detected Acoustically

 

  In the landing gear control module of an aircraft, a high-voltage IGBT is about to fail. In the solder bonding one chip’s ceramic base to its heat sink are three small air bubbles—voids, in the vocabulary of electronic failures. The three voids are close together, and the largest is almost directly under a hot spot on the die. Collectively the voids have diminished … [Read more...]

SANYO DENKI Releases 40 × 40 × 56 mm Counter Rotating Fan With the Highest Static Pressure in the Industry

 

SANYO DENKI has developed and launched the San Ace 40 9CRJ type 40 × 40 × 56 mm Counter Rotating Fan that features the highest static pressure in the industry.* This fan is suitable for cooling 1U servers, switching power supplies, and communications equipment. It also comes with the PWM control function to control the fan speed. Features: High Static Pressure and High … [Read more...]

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