ABSTRACT Reliability verification often requires that a specific number of components be tested to a predetermined level of testing to demonstrate that none of the samples fail. This article describes a statistical approach for justifying the use of fewer samples by subjecting them to a more severe level of testing. BACKGROUND Reliability verification often includes … [Read more...]
Thermal Comfort Considerations for Electronics Cooling and Design
Written by: Mark Hepokoski, ThermoAnalytics and Alex Ockfen, Meta Reality Labs Introduction ASHRAE defines thermal comfort as “that condition of mind that expresses satisfaction with the thermal environment” [1]. While engineers and designers are typically familiar with the thermal safety and compliance standards required in their industry [2], thermal comfort is less well … [Read more...]
Breaking Grounds with Generative Design for Two-phase Cooling of Electronic Devices
Since the size of electronic components keeps on decreasing, the need for improved heat dissipation on these components keeps increasing. This dichotomy presents thermal engineers with a formidable challenge: how to design smaller coolers that dissipate more heat. Adding to the challenge, the fast-paced evolution of electronics means that the development time for the new cooler … [Read more...]
Generative Design for Electronics Cooling
Co-Authored by: Danny J. Lohan, Yuqing Zhou, and Ercan M. Dede Toyota Research Institute of North America INTRODUCTION Generative design is an iterative design process that involves the use of a program to generate a set of optimized designs that meet product performance requirements and constraints. Methods that transform statements of performance requirements into … [Read more...]
Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards
Master Bond EP77M-FMed is a two part epoxy adhesive and sealant designed for use in the assembly of medical devices. It meets the ISO 10993-5 requirements and is not considered to have a cytotoxic effect. “This product has been formulated to provide excellent electrical and thermal conductivity properties, while keeping in mind processing constraints for heat sensitive … [Read more...]
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