Product: EP40Med Release Date: 04/13/2020 Master Bond EP40Med, a two-part epoxy system, combines toughness and a low tensile modulus while still providing a relatively high lap shear strength. It meets the requirements of ISO 10993-5 testing and is therefore considered to be non-cytotoxic. This compound can be used for bonding, sealing, coating and … [Read more...]
Thermal Management of Chip-on-Board LED Systems and Their Aging Response to Cyclic Power
By: Lisa Mitterhuber, Julien Magnien, Elke Kraker Introduction Twenty years ago, a lamp had exactly one purpose—to illuminate the room. A typical incandescent lamp lasted a year and failure was caused by a filament or/and a glass breakage [1]. Nowadays typical lighting is based on LED technology, which is considered as durable. Due to the fact that many materials are … [Read more...]
Keeping Cool as the Electric Vehicle Market Heats Up
Some of the biggest hurdles to widespread adoption of electric vehicles are range anxiety, battery longevity, and safety. As the electric vehicle market grows and for it to reach its full potential, there is an increased need for effective thermal management of the vehicles. Keeping heat under control leads to improved charging, performance, range, longevity, and safety. The … [Read more...]
Current Trends in Flexible Graphite for Cooling Advanced Consumer Electronics
Abstract As we entered the current century, consumer electronics were primarily cooled using aluminum. Over the last 15 years, flexible graphite heat spreaders have largely replaced aluminum for thermal management in many advanced consumer electronics devices where properties of being thin or lightweight are desired. There are two types of flexible graphite, natural and … [Read more...]
Thermal Interactions between High-power Packages and Heat Sinks, Part 2
Calculation Corner Bruce Guenin, Assoc. Technical Editor Introduction These days, many thermal engineers face the challenge of defining effective heat sink cooling solutions for high power processors and ASICs (Application-Specific Integrated Circuits). The usual practice would be to calculate a value of ΘJA (junction-to-air thermal resistance) for the … [Read more...]
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