Technical Brief John F. Maddox, Ph.D., P.E. The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Cosmopolitan Hotel and Casino in Las Vegas, NV from May 28-31, 2019. This was the 31st Anniversary of ITherm, first held in 1988. The conference was historically held every other year until 2016 when it … [Read more...]
ASHRAE Technical Committee 9.9: Mission Critical Facilities, Data Centers, Technology Spaces, and Electronic Equipment
Nomenclature A1, A2, A3, A4 ASHRAE allowable thermal envelopes as defined in Thermal Guidelines for Data Processing Environments that represent where IT manufacturers test equipment to ensure functionality ASHRAE American Society of Heating, Refrigerating and Air-Conditioning Engineers CAGR Compound Annual Growth Rate CITE ASHRAE Compliance for IT … [Read more...]
Laird Introduces IceKap™ P30000, a Novel, Non-Silicone, High Performance Thermal Interface Material for Lidded and Non-lidded Device Applications
Improving Thermal Performance and Device Reliability September 5, 2019 – Cleveland, Ohio, USA – Laird Performance Materials, a global manufacturer enabling and protecting sensitive electronics, has introduced IceKap™ P30000, a silicone-free, high performance thermal interface material (TIM) which takes advantage of a new polymer … [Read more...]
Thermal Facts & Fairy Tales: Whatever Happened to the Predicted Data Center Energy Consumption Apocalypse?
As the title indicates, since the middle of the last decade, there have been very pessimistic projections regarding the growth of the total annual energy used by data centers in the U.S. One of them suggested that by 2030, the energy consumption in the U.S. in the IT sector would be roughly 60% of that used by its entire industrial sector. [1,2,3] What was the origin of this … [Read more...]
Strategies for Using Thermal Calculation Methods
Thermal analysis tools available to engineers and scientists offer a wide variety of methods to solve problems. A cursory review of the past decade’s issues of Electronics Cooling magazine can show methods ranging from analytical techniques (such as hand calculations) to spreadsheets to full numerical/computational solutions such as CFD (Computational Fluid Dynamics) and FEA … [Read more...]
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