The first StatePoint™ Liquid Cooling system, “The World’s First Sustainable Data Center Cooling Technology,” reduces energy and water consumption in data centers. Oklahoma City, Okla., Dec. 16 , 2019 — Nortek Air Solutions (NAS), St. Louis, Mo., a leading provider of custom air handlers, celebrated the completion of its first manufactured StatePoint™ Liquid Cooling (SPLC) … [Read more...]
Heat Spreader Efficiency Improvements by Addition of Latent Heat Solution Materials
Introduction Electronics thermal management has become an increasingly important design focus as devices have become more constrained, more powerful, more expensive and more ubiquitous. To manage temperatures, particularly in mobile devices, thermal engineers typically use higher thermal conductivity components and materials. Electrical engineers strive to spatially … [Read more...]
Summary of the IEEE ITherm 2019 Conference
Technical Brief John F. Maddox, Ph.D., P.E. The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Cosmopolitan Hotel and Casino in Las Vegas, NV from May 28-31, 2019. This was the 31st Anniversary of ITherm, first held in 1988. The conference was historically held every other year until 2016 when it … [Read more...]
ASHRAE Technical Committee 9.9: Mission Critical Facilities, Data Centers, Technology Spaces, and Electronic Equipment
Nomenclature A1, A2, A3, A4 ASHRAE allowable thermal envelopes as defined in Thermal Guidelines for Data Processing Environments that represent where IT manufacturers test equipment to ensure functionality ASHRAE American Society of Heating, Refrigerating and Air-Conditioning Engineers CAGR Compound Annual Growth Rate CITE ASHRAE Compliance for IT … [Read more...]
Laird Introduces IceKap™ P30000, a Novel, Non-Silicone, High Performance Thermal Interface Material for Lidded and Non-lidded Device Applications
Improving Thermal Performance and Device Reliability September 5, 2019 – Cleveland, Ohio, USA – Laird Performance Materials, a global manufacturer enabling and protecting sensitive electronics, has introduced IceKap™ P30000, a silicone-free, high performance thermal interface material (TIM) which takes advantage of a new polymer … [Read more...]
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