Sponsor

Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

Sponsor

Multidirectional Mini Blower for Air-Flow Applications

 

Providing a solution for customized air-flow applications, JARO’s new JRB2235 series rotates at 8500 RPMs and produces a powerful 1.2 CFM of super-cooled air (with a static pressure of .122" of H2O). Operating voltage is 4.0V to 5.5VDC. The availability of single or dual unit configurations provides customers with the unique ability to select the precise direction(s) of … [Read more...]

ElectronicsCooling Summer 2010 Print Issue

 

Don't miss out on the Summer 2010 issue of ElectronicsCooling, which includes feature articles on thermal design in silicon validation platforms, motor supports and small scale fans, and solar photovoltaic cell thermal measurements. If you would like to receive your free copy of ElectronicsCooling click here to subscribe. Read the Summer 2010 issue here. … [Read more...]

The Uses of Simplicity in Thermal Analysis

 

Bruce Guenin, PhD Editor-in-Chief, Summer 2010 Issue The dramatic trajectory of Moore’s law has produced a number of changes in key areas of technology that are critical to our industry: 1) greater packaging and system complexity; 2) increased power dissipation; and 3) enhanced software tools and computing performance. The first two we put into the challenge category. They … [Read more...]

Calculation Corner: Using Vendor Data to Estimate Thermoelectric Module Cooling Performance in An Application Environment

 

The application of thermoelectric devices to cool electronic components has been of interest to thermal engineers for many years. Thermoelectric (TE) cooling modules offer the potential to either reduce component operating temperatures at a given heat load, or allow higher component heat dissipation at a given temperature level. Readers who are unfamiliar with TE cooling … [Read more...]

Thermal Facts and Fairy Tales: Uncertainty is Assured

 

Do you know the thermal conductivity of paper? This was the start of a phone call a few years ago. The conversation continued and the reason for the question became apparent. A thermal analysis of a printed circuit board had determined that a thermal interface material was needed under some hotter components to provide a better conduction path. The circuit card was edge cooled … [Read more...]

Industry Sponsors

Sponsor
Sponsor