A team of scientists at Massachusetts Institute of Technology have discovered a previously unknown phenomenon that can cause powerful waves of energy to shoot through minuscule wires known as carbon nanotubes. The discovery could lead to a new way of producing electricity, the researchers say. The phenomenon, described as thermopower waves, is such a new discovery that it’s … [Read more...]
ElectronicsCooling Spring 2010 Print Issue
Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in the economy as a whole, and specifically within the electronics thermal management community, we can hope that this is a sign of improvement and recovery. We will … [Read more...]
thermal facts and fairy tales: most of us live neither in wind tunnels nor in the world of Nusselt
Having read myriad papers/articles/books/reports on thermal management, I feel there is a lot of misunderstanding about what really should drive a sound approach of how to tackle the thermal problems that tend to land on the desk of thermal designers. I also have the feeling that many “how to” articles presented on the Web are just meant to show off the knowledge of the author … [Read more...]
electronics cooling in the automotive environment
Introduction By 2008 the electronics content of a typical consumer vehicle had grown to 20-25% of the total vehicle cost [1]. This content provides a wide range of functions and features for today’s driver. Some features such as the radio/audio system and instrument cluster are quite familiar and visible to the driver and have been mainstays in the automobile for many years. … [Read more...]
Carbon Nanotubes as High Performance Thermal Interface Materials
Introduction Because of substantial increases in the power density of electronic packages over the past few decades, thermal interface resistance can comprise more than 50% of the total thermal resistance in current high-power packages [1]. Unless advanced thermal interface materials (TIMs) that achieve order-of-magnitude improvements in performance quickly emerge in the … [Read more...]
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