Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 … [Read more...]
Researchers Cool Down Supercomputers with Warm Water
A team of IBM researchers in Switzerland is experimenting with a micro network of copper tubes that run through smaller, clustered computer servers and whisk away heat with the help of warm water. Liquid cooling, even with warm water, is 4,000 times more effective than air cooling at removing heat, they say. Researchers from IBM and the Swiss Federal Institute of Technology in … [Read more...]
IC Package Thermal Characterization Made Easy
FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the needs of design engineers and thermal specialists alike, FloTHERM IC offers the ease-of-use of Smartpart technology combined with the power of FloTHERM to greatly boost productivity … [Read more...]
Enhanced Version of Thermoelectric Module Simulation Software
Laird Technologies, Inc. recently launched an enhanced version of its online thermoelectric module (TEM) simulation software tool: AZTEC™. AZTEC selects the optimal TEM(s) for trial from a given set of input variables based on application attributes that the user specifies. The program also contains an analysis worksheet, which simulates how the TEM(s) will function under a … [Read more...]
Software Tool Available for Simulating Cooling Performance of Data Center
Innovative Research, Inc. recently released TileFlow 4.2, a new version of its three-dimensional software tool for simulating cooling performance of data center. TileFlow now allows users to include upflow CRAC units in the data center layouts. For these units, the dimensions, the details of the return and supply openings, the flow rate, and the cooling characteristics are … [Read more...]
- « Previous Page
- 1
- …
- 28
- 29
- 30
- 31
- 32
- …
- 34
- Next Page »
