Thermacore, Inc., a provider of heat pipe technology and other thermal management solutions, announced that Thermacore Europe is making progress as lead partner of an 8.3 million euro ($11.4M) European research project, NanoHex. The team is tasked with developing a next-generation liquid coolant that incorporates purpose engineered nano-particles for more efficient … [Read more...]
Toward Liquid-Cooled Computers
Experts say a new technique called superwicking could provide a better way to cool computer hardware and could help remove one of the biggest barriers to a new generation of high-powered microprocessors. And in the meantime, it could prove a boon to tiny fluid-based sensors. Optical physicists Chunlei Guo and Anatoliy Vorobyev of the University of Rochester in New York state … [Read more...]
THERMINATOR Project Warms Efforts to Cool Semiconductor Design Solutions
The partners in a new EU-funded research project recently announced details of the multinational/multidisciplinary program: “THERMINATOR: Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future.” This three-year project is designed to maintain the strong positions that Europe’s semiconductor and electronics equipment companies have achieved in … [Read more...]
Textbook covers basic heat transfer theory, practical guidelines
“Heat Transfer: Thermal Management of Electronics,” a reference and textbook by Dr. Younes Shabany, includes both basic heat transfer theory as well as practical guidelines for solving thermal design problems that are common to electronic products. Younes Shabany is with the Advanced Technology Group at Flextronics and also teaches at San Jose State University. The book is … [Read more...]
New heat sink series provide secure attachment with minimum of board real estate
Alpha’s series of heat sinks feature an innovative attachment mechanism. Electronic components have become faster and more compact, generating more heat and increasing thermal densities. This has led to the use of heat sinks of increased size and mass. One of the biggest challenges for thermal/mechanical engineers is mechanically mounting larger heat sinks while minimizing the … [Read more...]
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