Nuventix, Inc., innovator of SynJet® active thermal management solutions, has signed a Manufacturing Services Agreement with Nypro Inc., which provides plastic injection molding and turn-key assembly of Nuventix products. Under the terms of the agreement, Nypro will perform new product introduction and manufacturing services for Nuventix. Nypro will provide development and … [Read more...]
3D chip stacking to take Moore’s Law past 2020, pose new chip cooling challenges
A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states that the number of transistors that can be placed inexpensively on an integrated circuit will double every 18 months. More than 50 years old, this law is still in effect, but to extend it as long as 2020 will require a change from mere … [Read more...]
Department of Energy announces $100 million for innovative research projects
At the inaugural ARPA-E Energy Innovation Summit, U.S. Energy Secretary Steven Chu announced $100 million in Recovery Act funding will be made available to accelerate innovation in green technology, increase America’s competitiveness and create new jobs. Of the three technology focus areas destined to receive funding, one of interest to ElectronicsCooling readers involves … [Read more...]
The Better Box Model
Introduction For the consumer, natural convection cooling or fan-less cooling is the method of choice. It is silent, it is reliable, it is simple, and it is environmentally sound because no additional energy is used to remove the excess heat. For the thermal engineer, fan-less cooling is more problematic. On the plus side, no fan is needed, so there is an attractive cost … [Read more...]
Use of Power Law Regression in Packaging Thermal Calculations
Introduction In today’s demanding business climate, thermal engineers are often called upon to produce thermal analyses rapidly. For example, there is frequently the need for a quick calculation of a JEDEC-standard thermal performance metric, such as ΘJA (junction-to-ambient thermal resistance), for specific IC package designs on the basis of limited data. These metrics are in … [Read more...]
